Thermal & Cooling Systems
Liquid cooling, two-phase, immersion, cold-plate, and rack-level thermal design for AI compute and high-density data centers.
Recruiting specialized engineering talent across semiconductor manufacturing, thermal management, advanced cooling technologies, electronics, and critical infrastructure supporting next-gen computing.
Liquid cooling, two-phase, immersion, cold-plate, and rack-level thermal design for AI compute and high-density data centers.
Process integration, fab operations, equipment engineering, yield improvement, and cleanroom production at leading-edge nodes.
Enclosure design, structural analysis, fluid dynamics, and reliability for compute hardware, modules, and critical infrastructure.
Power delivery, signal integrity, PCB design, and board-level engineering for high-performance compute platforms.
2.5D / 3D packaging, CoWoS, fan-out, substrate technology, and thermal-aware co-design.
Silicon bring-up, thermal characterization, debug, and PVT qualification for production hardware.
The specialties we source and vet across design, fab, packaging, and validation.
Start with a pilot engagement and grow into a managed permanent bench spanning thermal & cooling systems, semiconductor manufacturing, mechanical & electrical engineering, and advanced packaging.